| Chassis type |
Micro Tower |
| Combo headphone/mic port |
Yes |
| Country of origin |
China |
| CPU configuration (max) |
1 |
| Depth |
303 mm |
| Discrete graphics adapter |
No |
| Discrete graphics adapter model |
Not available |
| Display included |
No |
| DisplayPort version |
1.4 |
| DisplayPorts quantity |
1 |
| DVI port |
No |
| ECC |
No |
| Embedded options available |
No |
| Enhanced Intel SpeedStep Technology |
Yes |
| Ethernet LAN |
Yes |
| Ethernet LAN (RJ-45) ports |
1 |
| Ethernet LAN data rates |
10 -100 -1000 Mbit/s |
| Execute Disable Bit |
Yes |
| HDMI ports quantity |
1 |
| HDMI version |
1.4 |
| Headphone outputs |
1 |
| Height |
337 mm |
| HP segment |
Business |
| Idle States |
Yes |
| Intel 64 |
Yes |
| Intel Clear Video Technology |
Yes |
| Intel Software Guard Extensions (Intel SGX) |
Yes |
| Intel Stable Image Platform Program (SIPP) |
No |
| Intel Trusted Execution Technology |
No |
| Intel Virtualization Technology (VT-x) |
Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Yes |
| Intel VT-x with Extended Page Tables (EPT) |
Yes |
| Intel® AES New Instructions (Intel® AES-NI) |
Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) |
Yes |
| Intel® Identity Protection Technology (Intel® IPT) |
Yes |
| Intel® InTru™ 3D Technology |
Yes |
| Intel® OS Guard |
Yes |
| Intel® Quick Sync Video Technology |
Yes |
| Intel® Secure Key |
Yes |
| Intel® Turbo Boost Technology |
2.0 |
| Internal memory |
8 GB |
| Internal memory type |
DDR4-SDRAM |
| Keyboard included |
Yes |
| Line-out |
Yes |
| M.2 card slot (storage) |
1 |
| M.2 card slot (wireless) |
1 |
| Market positioning |
Proven productivity |
| Maximum internal memory |
64 GB |
| Maximum internal memory supported by processor |
128 GB |
| Maximum number of PCI Express lanes |
16 |
| Maximum on-board graphics adapter memory |
64 GB |
| Memory bandwidth supported by processor (max) |
41.6 GB/s |
| Memory clock speed |
2666 MHz |
| Memory clock speeds supported by processor |
2666 MHz |
| Memory layout (slots x size) |
1 x 8 GB |
| Memory slots |
2x DIMM |
| Memory types supported by processor |
DDR4-SDRAM |
| Microphone in |
No |
| Motherboard chipset |
Intel Q470 |
| Mouse included |
Yes |
| Number of 2.5" bays |
1 |
| Number of 3.5" bays |
2 |
| Number of displays supported (on-board graphics) |
3 |
| Number of processors installed |
1 |
| Number of SSDs installed |
1 |
| On-board graphics adapter |
Yes |
| On-board graphics adapter base frequency |
350 MHz |
| On-board graphics adapter DirectX version |
12.0 |
| On-board graphics adapter dynamic frequency (max) |
1100 MHz |
| On-board graphics adapter ID |
0x9BC8 |
| On-board graphics adapter model |
Intel UHD Graphics 630 |
| On-board graphics adapter OpenGL version |
4.5 |
| Operating relative humidity (H-H) |
5 - 90% |
| Operating system architecture |
64-bit |
| Operating system installed |
Windows 10 Pro |
| Operating temperature (T-T) |
5 - 35 C |
| Optical Drive Type |
DVD-RW |
| Package depth |
287 mm |
| Package height |
499 mm |
| Package weight |
7650 g |
| Package width |
400 mm |
| Password protection type |
Power on |
| PCI Express configurations |
1x16 -2x8 -1x8+2x4 |
| PCI Express slots version |
3.0 |
| PCI Express x1 (Gen 3.x) slots |
2 |
| PCI Express x16 (Gen 3.x) slots |
3 |
| Processor ARK ID |
199283 |
| Processor boost frequency |
4.3 GHz |
| Processor cache |
6 MB |
| Processor cache type |
L3 |
| Processor codename |
Comet Lake |
| Processor cores |
4 |
| Processor family |
10th gen Intel Core i3 |
| Processor frequency |
3.6 GHz |
| Processor lithography |
14 nm |
| Processor manufacturer |
Intel |
| Processor model |
i3-10100 |
| Processor operating modes |
64-bit |
| Processor package size |
37.5 x 37.5 mm |
| Processor socket |
LGA 1200 (Socket H5) |
| Processor threads |
8 |
| Product colour |
Black |
| Product Type |
PC |
| Scalability |
1S |
| SSD capacity |
256 GB |
| SSD form factor |
M.2 |
| SSD interface |
NVMe |
| Storage media |
SSD |
| Supported instruction sets |
SSE4.1 -SSE4.2 -AVX 2.0 |
| System bus rate |
8 GT/s |
| Thermal Design Power (TDP) |
65 W |
| Thermal Monitoring Technologies |
Yes |
| Thermal solution specification |
PCG 2015C |
| Tjunction |
100 C |
| Total SSDs capacity |
256 GB |
| Total Storage Capacity |
256 GB |
| Trusted Platform Module (TPM) |
Yes |
| USB 2.0 ports quantity |
4 |
| USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity |
3 |
| USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity |
2 |
| Warranty Duration |
12 |
| Weight |
5 kg |
| Wi-Fi |
No |
| Width |
155 mm |